Features
* 3.0 PACKAGE CONFIGURATIONS 7 3.1 153 Ball Pin Configuration 7 3.2 169 Ball Pin Configuration 8 3.2.1 11.5mm x 13mm x 1.0mm Package Dimension 9 3.2.2 12mm x 16mm x 1.0mm Package Dimension 9 3.2.3 12mm x 16mm x 1.2mm Package Dimension 10 3.3 Product Architecture 11 4.0 e. MMC 4.41 features 12 4.1 DApplications
* where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office.
Datasheet Details
Part number:
KLMCG8WE4A-A001, KLM4G1YE4C-B001
Manufacturer:
Samsung
File Size:
573.57 KB
Description:
embedded MMC solution
Note:
This datasheet PDF includes multiple part numbers: KLMCG8WE4A-A001, KLM4G1YE4C-B001.
Please refer to the document for exact specifications by model.
KLMCG8WE4A-A001 Distributors
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