* Radiation graphs available Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 12 kÅ min. Au - 6.5 kÅ nom. 2.3 mils x 7.0 mils 5.0 mils x 11.0 mils 8 mils nominal 30 mils x 30 mils Silox Passivated Electrical Characteristics
SQ3019
Semicoa Semiconductor
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Chip type 2c3019 geometry 4500 polarity pnp.
Data Sheet No. 2C3019
Chip Type 2C3019 Geometry 4500 Polarity PNP
Generic Packaged Parts: 2N3019, 2N3057
Chip type 2C3019 by Semicoa Semiconductors.
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