* High frequency rating Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.7 mils x 2.7 mils 2.7 mils x 2.7 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical Characterist
SQ918F
Semicoa Semiconductor
30.77 KB
Chip type 2c918 geometry 0013 polarity npn.
Data Sheet No. 2C918
Chip Type 2C918 Geometry 0013 Polarity NPN
Generic Packaged Parts: 2N918
Chip type 2C918 by Semicoa Semiconductors provides pe.
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