SK50DGDL066ETE2 - IGBT

Semikron

Datasheet Details

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Low inductive design.
Press-Fit contact technology.
Rugged mounting due to integrated mounting clamps.
Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC).
Trench IGBT3 technology.
Robust and soft switching CAL4F diode technology.
Integrated NTC temperature sensor.
UL recognized file no. E 63 532 Typical.

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Published: Mar 19, 2021 |