Datasheet Specifications
- Part number
- SFC05-4TM
- Manufacturer
- Semtech Corporation
- File Size
- 174.75 KB
- Datasheet
- SFC05-4TM_SemtechCorporation.pdf
- Description
- CSP TVS Flip Chip TVS Diode Array
Description
CSP TVS Flip Chip TVS Diode Array PROTECTION PRODUCTS .Features
* u 300 Watts peak pulse power (tp = 8/20µs) u Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small chip scale package requires less board space Low profile (< 0.65mm) No need for underfill maApplications
* CSP TVS devices are compatible with current pick and place equipment and assembly methods. Each device will protect up to four data or I/O lines. The CSP design results in lower inductance, virtually eliminating voltage overshoot due to leads and interconnecting bond wires. They may be used to meetSFC05-4TM Distributors
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