Datasheet Specifications
- Part number
- LGQ971
- Manufacturer
- Siemens Semiconductor Group
- File Size
- 54.62 KB
- Datasheet
- LGQ971_SiemensSemiconductorGroup.pdf
- Description
- CHIPLED
Description
CHIPLED LG Q971 Besondere Merkmale q q q q q q Gehäusebauform: 0603 Industriestandard bzgl.Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet.
Features
* q q q q q q 0603 package Industry standard footprint low profile suitable for IR reflow soldering process for use as optical indicator and backlighting available taped on reel (8 mm tape) Typ Type Emissions- Farbe der farbe Lichtaustrittsfläche Color of Color of the Emission Light Emitting AreaLGQ971 Distributors
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