* q q q q q q 0805 package Industry standard footprint low profile suitable for IR reflow soldering process for use as optical indicator and backlighting available taped on reel (8 mm tape) Typ Type Emissions- Farbe der farbe Lichtaustrittsfläche Color of Color of the Emission Light Emitting Area
LGR971
Siemens Semiconductor Group
52.02 KB
Chipled.
CHIPLED
LG R971
Besondere Merkmale
q q q q q q
Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet.
📁 Related Datasheet
LGR971-KO CHIPLED (Siemens Semiconductor Group)
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