Datasheet Specifications
- Part number
- LYR970
- Manufacturer
- Siemens Semiconductor Group
- File Size
- 60.28 KB
- Datasheet
- LYR970_SiemensSemiconductorGroup.pdf
- Description
- CHIPLED
Description
CHIPLED LY R970, LO R970, LS R970 Besondere Merkmale q q q q q q Gehäusebauform: 0805 Industriestandard bzgl.Lötpadraster geringe Bauteilhöhe für .
Features
* q q q q q q 0805 package Industry standard footprint low profile suitable for IR reflow soldering process for use as optical indicator and backlighting available taped on reel (8 mm tape) Typ Emissionsfarbe Color of Emission Type Farbe der Lichtaustrittsfläche Color of the Light Emitting Area cLYR970 Distributors
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