* q q q q q q 0805 package Industry standard footprint low profile suitable for IR reflow soldering process for use as optical indicator and backlighting available taped on reel (8 mm tape) Typ Emissionsfarbe Color of Emission Type Farbe der Lichtaustrittsfläche Color of the Light Emitting Area c
LYR970
Siemens Semiconductor Group
60.28 KB
Chipled.
CHIPLED LY R970, LO R970, LS R970 Besondere Merkmale q q q q q q Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für .
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