Part number:
TOIM3000
Manufacturer:
TEMIC Semiconductors
File Size:
123.44 KB
Description:
Infrared irda integrated interface circuits
TOIM3000 Datasheet (123.44 KB)
TOIM3000 Datasheet (123.44 KB)
TOIM3000
TEMIC Semiconductors
123.44 KB
Infrared irda integrated interface circuits
* TOIM3000 D Pulse shaping function (shortening and stretching) used in infrared IrDA standard applications D Directly interfaces the infrared transceiver TFDS3000
* ) to a UART or a microcontroller D 3 V and 5 V operation with low operating current D SO16L package TOIM3232 D Pulse shaping function
📁 Related Datasheet
TOIM3000 - Infrared IrDA Integrated Interface Circuits
(TEMIC Semiconductors)
TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, .
TOIM3000 - Infrared IrDA Integrated Interface Circuits
(TEMIC Semiconductors)
TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, .
TOIM3232 - Infrared IrDA Integrated Interface Circuits
(TEMIC Semiconductors)
TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, .
TOIM3232 - Infrared IrDA Integrated Interface Circuits
(TEMIC Semiconductors)
TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, .
TOIM3232 - Infrared IrDA Integrated Interface Circuits
(TEMIC Semiconductors)
TOIM3000/3232
Infrared IrDA Integrated Interface Circuits
ULC-Technology: High-performance gate array package using dual metal layer CMOS technology, .
TOIM3232 - Integrated Interface Circuits
(Vishay Siliconix)
TOIM3232
Vishay Telefunken
Integrated Interface Circuits
ULC Technology: High-performance gate array package using dual metal layer CMOS technology, .
