Description
Green compound Green compound
PACKAGE OUTLINE DIMENSION
C
B
DIM.A B C
Unit (mm)
Min 3.30 1.40 0.20
Max 3.70 1.60 0.50
Unit (inch)
Min 0.130 0.055 0.008
Max 0.146 0.063 0.020
SUGGEST PAD LAYOUT
A
DIM.A B C D
Unit (mm)
Typ.1.25 2.00 2.50 5.00
Unit (inch)
Typ.0.049 0.079 0.098 0.197
Document Number: DS_S1408009
Version: B14
Small Signal Product
BZV55C2V4 thru BZV55C75
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without n
Features
- - Zener voltage range : 2.4V to 75V - Surface device type mounting - Hermetically sealed glasss - Compression bonded construction - Matte Tin (Sn) lead finish - Pb free and RoHS compliant - All external surfaces are corrosion resistant and
terminals are readily solderable.