HS3JB Datasheet | Taiwan Semiconductor

Features — Glass passivated junction chip. — For surface mounted application — Low forward voltage drop — Low profile package — Built-in stain relief, ideal for automatic placement — Fast switching for high efficiency — High temperature soldering: 260℃/10 seconds at terminals — Meet MSL level 1, per J-STD-020D, lead free maximum peak of 260℃ — Plastic material used carries Underwriters Laboratory Classification 94V-0 — Green pound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data — Case: Molded plastic — Terminal: Pure tin plated, lead free — Polarity: Indicated by cathode band — Packing: 12mm tape per EIA STD RS-481 — Weight: 0.093 grams Ordering Information (example) Part No. Package Packing Packing code Packing code (Green) HS3AB SMB 850 / 7" REEL R5 R5G Maximum Ratings and Electrical Characteristics Rating at 25 ℃ ambient temperature unless otherwise specified. Parameter Maximum Repetitive Peak Reverse Voltage Symbol HS 3AB HS 3BB HS 3DB HS 3FB HS 3GB HS 3JB VRRM 50 100 200 300 400 600 Maximum RMS Voltage VRMS 35 70 140 210 280 420 Maximum DC Blocking Voltage VDC 50 100 200 300 400 600 Maximum Average Forward Rectified Current IF(AV) Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC...