TMBR6S05 Datasheet - Taiwan Semiconductor

TMBR6S05 Silicon Bridge Rectifiers

Multiple manufacture source Multiple manufacture source Green compound Defined manufacture source Green compound PACKAGE OUTLINE DIMENSIONS TMB DIM. A B C E F G H J K L M Unit (mm) Min Max 4.50 4.70 3.60 3.80 1.20 Typ. 0.45 0.65 2.60 2.80 0.60 0.80 0.05 0.15 0.20 Typ. 6.60 7.00 5.10 5.50 0.90 1.1.

TMBR6S05 Features

* - Ultra low leakage current IR < 2μA, TA = 125°C - No solder used, real fully in line with lead free - Package thickness is 1.2 mm - High ESD > 12 kV ( HBM model ) - Plastic material has U/L flammability classification 94V-0 - High temperature soldering guaranteed: 260°C/10s ( Reflow ) - High temper

TMBR6S05-TaiwanSemiconductor.pdf