* ± Glass passivated or planar junction ± Excellent clamping capability ± Repetition rate (duty cycle): 0.01% ± Low profile package and low inductance ± 400W Peak Pulse power capability at 10×1000μs waveform. ± Fast response time: typically less than 1.0ps from 0V to VBR min. ± High temperature solder
P4SMFT9.0CA Datasheet (5.33 MB)
P4SMFT9.0CA
UMD
5.33 MB
Tvs.
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UNITED MICRO DEVICE INC. P4SMFT Series
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