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GLZ2.0 - SURFACE MOUNT ZENER DIODES

UPM

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Datasheet Details

Part number	GLZ2.0
Manufacturer	UPM
File Size	742.65 KB
Description	SURFACE MOUNT ZENER DIODES
Datasheet	GLZ2.0-UPM.pdf

GLZ2.0 Product details

Features

Planar Die construction.
500mW Power Dissipation.
Ideally Suited for Automated Assembly Processes.
Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI-MELF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx. Weight: 0.03 grams Mounting Position: Any Packing information T/R - 2.5K per 7" plastic Reel T/R - 10K p.

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Published: Mar 6, 2020 |