Description
www.DataSheet.co.kr New Product UH3B, UH3C & UH3D Vishay General Semiconductor Surface Mount Ultrafast Rectifier .
Features
* Low profile package
* Ideal for automated placement
* Oxide planar chip junction
* Ultrafast recovery times for high frequency
* Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
* Solder dip 260 °C, 40 s
DO-214AB (SMC)
* Compliant
Applications
* For use in secondary rectification and freewheeling for ultrafast switching speeds of ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications. 3.0 A
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 3.0 A TJ max. 100 V, 150 V, 200 V 80 A 2
