Description
SAP MATERIAL AND ORDERING NUMBER (1)
4700
1, 2, 3, 5
3435
1
Bare die with top / bottom silver terminations
NTCC200E4472
T
12 000
1, 2, 3, 5
3740
1
Bare die with top / bottom silver terminations
NTCC200E4123
T
20 000
1, 2, 3, 5
3865
1
Bare die with top / bottom silver terminations
NTCC200E4203
T
4700
1, 2, 3, 5
3435
1
Bare die with top / bottom gold terminations
NTCC300E4472
T
12 000
1, 2, 3, 5
3740
1
Bare die with top / bottom gold terminations
NTCC
Features
- Flat chip contacted top and bottom
(gold: NTCC300E4 series or silver: NTCC200E4 series).
- Green thermistor - does not use RoHS exemptions.
- Wide temperature range from -55 °C to +175 °C.
- Highly resistant to thermal shocks.
- Ideal for wire bonding (aluminum or gold depending on metalization type).
- Resistance to leaching.
- Delivered on blister tape.
- AEC-Q200 qualified.
- Material categorization: for definitions of complian.