S1J-M3
FEATURES
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Material categorization: for definitions of pliance please see .vishay./doc?99912
MECHANICAL DATA Case: DO-214AC (SMA) Molding pound meets UL 94 V-0...
