UGB8BT Features
* Glass passivated chip junction
* Ultrafast recovery time
* Low switching losses, high efficiency
* High forward surge capability
* Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
* Solder dip 260 °C, 40 s (for TO-22
Datasheet Details
UGB8BT, UGB8AT
131.46 KB
Ultrafast rectifier.
This datasheet PDF includes multiple part numbers: UGB8BT, UGB8AT.
Please refer to the document for exact specifications by model.
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UGB8BT Distributor
