SKFM10100Y-D
Features
Package outline
SOD-123H
Features optimize board space.
- Low profile surface mounted application in order to
Package outline
0.146(3.7) 0.130(3.3) DPAK 0.012(0.3) Typ. process excellent power dissipation offers
- Batch powerdesign, loss, high efficiency.
- Low better reverse leakage current and thermal resistance. current capability, low forward voltage drop.
- High profile surface mounted application in order to
- Low surge capability.
- High optimize board space.
- Guardring for overvoltage protection.
- Low power loss, high efficiency.
- Ultra high-speed switching.
- High current capability, low forward voltage drop.
- Silicon epitaxial planar chip, metal silicon junction.
- High surge capability.
- Lead-free parts meet environmental standards of for overvoltage
- Guardring MIL-STD-19500 /228 protection. high-speed
- Ultra productswitching. for packing code suffix "G"
- Ro HS epitaxial metal silicon junction.
- Silicon Halogen free planar productchip, for packing code...
