Datasheet4U Logo Datasheet4U.com

236 Datasheet - Wakefield Thermal Solutions

Board Level Power Semiconductor Heat Sinks

236 Features

* for TO-220 semiconductors. Their unique design (patent pending) ensures uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating the need for fastening hardware. A mounting hole is available for hardware mounting

236 Datasheet (261.37 KB)

Preview of 236 PDF

Datasheet Details

Part number:

236

Manufacturer:

Wakefield Thermal Solutions

File Size:

261.37 KB

Description:

Board level power semiconductor heat sinks.
BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Surface Mount Heat Sinks Heigh.

📁 Related Datasheet

230-JC6DT3 DIESEL ENGINE-GENERATOR SET (MTU Onsite Energy)

230-JS6DT3 DIESEL ENGINE-GENERATOR SET (MTU Onsite Energy)

2300 100 pin Strip Header (3M)

2300F N-Channel MOSFET (GOFORD)

2301 P-Channel Enhancement Mode Power MOSFET (GFD)

2301 18V P-channel enhanced MOSFET (ChipSourceTek)

2301-RC High Current Toroid Inductors (Bourns)

2301H N-Channel MOSFET (GOFORD)

2302 Class C Microwave (ETC)

2302 N-Channel MOSFET (ETC)

TAGS

236 Board Level Power Semiconductor Heat Sinks Wakefield Thermal Solutions

Image Gallery

236 Datasheet Preview Page 2 236 Datasheet Preview Page 3

236 Distributor