236 Datasheet - Wakefield Thermal Solutions

236 Board Level Power Semiconductor Heat Sinks

BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Surface Mount Heat Sinks Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250 D 2PAK, TO-220, SOL-20 Thermal Performance at Typical Load Natural Convection Forced Convection 55°C .

236 Features

* for TO-220 semiconductors. Their unique design (patent pending) ensures uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating the need for fastening hardware. A mounting hole is available for hardware mounting

236_WakefieldThermalSolutions.pdf