Part number:
236
Manufacturer:
Wakefield Thermal Solutions
File Size:
261.37 KB
Description:
Board level power semiconductor heat sinks.
236 Features
* for TO-220 semiconductors. Their unique design (patent pending) ensures uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating the need for fastening hardware. A mounting hole is available for hardware mounting
Datasheet Details
236
Wakefield Thermal Solutions
261.37 KB
Board level power semiconductor heat sinks.
📁 Related Datasheet
230-JC6DT3 DIESEL ENGINE-GENERATOR SET (MTU Onsite Energy)
230-JS6DT3 DIESEL ENGINE-GENERATOR SET (MTU Onsite Energy)
2300 100 pin Strip Header (3M)
2300F N-Channel MOSFET (GOFORD)
2301 P-Channel Enhancement Mode Power MOSFET (GFD)
2301 18V P-channel enhanced MOSFET (ChipSourceTek)
2301-RC High Current Toroid Inductors (Bourns)
2301H N-Channel MOSFET (GOFORD)
236 Distributor