W83627UHG
Winbond
1.77MB
Winbond lpc i/o. of CRF0. 1. 2. Substitute “TControl” with “TBase” Modify the pin descriptions of INDEX#, SOUTF, TRAK0#, WP#, RDATA#, DSKCHG#, HEFRAS,
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Publication Release Date: October 26, 2010 -I- Revision 1.7
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W83627EHF - LPC I/O
(Winbond Electronics)
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U 4 t W83627EHF e e W83627EHG h WINBOND LPC I/O S a t a .D w
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Date: Mar 18 2005
Revision: .
W83627EHF-EF - LPC I/O
(Winbond)
W83627EHF/EF W83627EHG/EG WINBOND LPC I/O
Note: This document is both for UBC and UBH version except specified descriptions
Date : April 20, 2007 Revi.
W83627EHG - LPC I/O
(Winbond Electronics)
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U 4 t W83627EHF e e W83627EHG h WINBOND LPC I/O S a t a .D w
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Date: Mar 18 2005
Revision: .
W83627EHG-EG - LPC I/O
(Winbond)
W83627EHF/EF W83627EHG/EG WINBOND LPC I/O
Note: This document is both for UBC and UBH version except specified descriptions
Date : April 20, 2007 Revi.
W83627F - LPC I/O
(Winbond)
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W83627HF/F W83627HG/G Winbond LPC I/O
Date： 2006/06/09
Revision： 2.27
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W83627G - LPC I/O
(Winbond)
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W83627HF/F W83627HG/G Winbond LPC I/O
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Revision： 2.27
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