* í Open top type sockets with "Tweezer Style Contacts" For FBGA packages í Secure package alignment due to self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls Outline Base Socket Dimensio
NP352
Yamaichi
426.63 KB
Fine ball grid array.
NP352 Series (Open Top) Fine Ball Grid Array (FBGA, 1.00mm Pitch) Specifications Insulation Resistance: 1,000MW min. at 100V DC Dielectric Withsta.
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