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BC54-16PAS-Q - 1A NPN medium power transistors

Download the BC54-16PAS-Q datasheet PDF. This datasheet also covers the BC54PAS-Q variant, as both devices belong to the same 1a npn medium power transistors family and are provided as variant models within a single manufacturer datasheet.

General Description

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

2.

Key Features

  • High collector current capability IC and ICM.
  • Reduced Printed-Circuit Board (PCB) area requirements.
  • Exposed heat sink for excellent thermal and electrical conductivity.
  • Two current gain selections.
  • Leadless very small SMD plastic package with medium power capability.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint.
  • Qualified according to AEC-Q101 and recommended for use in automotive.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BC54PAS-Q-nexperia.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Nexperia

Part Number Description
BC54-16PAS 1A NPN medium power transistors
BC54-16PA 1A NPN medium power transistors
BC54-16PA-Q 45V 1A NPN medium power transistors
BC54-10PA 1A NPN medium power transistors
BC54-10PA-Q 45V 1A NPN medium power transistors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BC54xPAS-Q series 45 V, 1 A NPN medium power transistors 27 April 2023 Product data sheet 1. General description NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. 2. Features and benefits • High collector current capability IC and ICM • Reduced Printed-Circuit Board (PCB) area requirements • Exposed heat sink for excellent thermal and electrical conductivity • Two current gain selections • Leadless very small SMD plastic package with medium power capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Qualified according to AEC-Q101 and recommended for use in automotive applications 3.