3M Electronics 7G24
3M Connector
| Part No. | 7G24 |
|---|---|
| Datasheet | 7G24 Download |
| Manufacturer |  3M Electronics |
| Description | 3M Connector |
| Buy | Stock & Price |
3M™ Connector for CFast™ Card ™ 7G24 Series
● Headers mate with both CFast Type I and Type II cards
● Extended guide rails enable accurate and easy card insertion
● Single row surface mount solder tails facilitate auto placement and IR soldering
● Optional 2 mm board standoff enables board population
● Meets CFA standards for known compatibility and reliability
● Optional ejector and card retainer can be purchased pre-assembled or separately
● Integral side solder tab with card grounding feature and also prevent the card from ‘flying’ out of header during ejection
● See the Regulatory Information Appendix (RIA) in the “RoHS compliance” section of for compliance information (RIA E1 & C1 apply) Date Modified: May 12, 2010 TS-2329-A Sheet 1 of 4 Physical Material: High Temperature Thermoplastic Flammability: UL 94V-0 Color: Beige Insulation: Contact: Terminal Plating: Material: Copper Alloy Underplating: 80 µ" [2.03 µm] Min. Nickel Wiping Area: 15 µ” or 30 µ” [0.38 – 0.76 µm] Min. Gold Solder Tail: 100 µ” [2.54 µm] Min.
● Headers mate with both CFast Type I and Type II cards
● Extended guide rails enable accurate and easy card insertion
● Single row surface mount solder tails facilitate auto placement and IR soldering
● Optional 2 mm board standoff enables board population
● Meets CFA standards for known compatibility and reliability
● Optional ejector and card retainer can be purchased pre-assembled or separately
● Integral side solder tab with card grounding feature and also prevent the card from ‘flying’ out of header during ejection
● See the Regulatory Information Appendix (RIA) in the “RoHS compliance” section of for compliance information (RIA E1 & C1 apply) Date Modified: May 12, 2010 TS-2329-A Sheet 1 of 4 Physical Material: High Temperature Thermoplastic Flammability: UL 94V-0 Color: Beige Insulation: Contact: Terminal Plating: Material: Copper Alloy Underplating: 80 µ" [2.03 µm] Min. Nickel Wiping Area: 15 µ” or 30 µ” [0.38 – 0.76 µm] Min. Gold Solder Tail: 100 µ” [2.54 µm] Min.
