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SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G
A
ABC'S DWG NO. ABC'S ITEM NO.
MB1608□□□□5□
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D
D
C
B
I
G PCB Pattern
I Unit : m/m
Series MB1608
A 1.60±0.15
B 0.80±0.15
C 0.80±0.15
D 0.30±0.20
G 0.7
H 0.7
H I 0.7
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SCHEMATIC DIAGRAM ¡G
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MATERIALS ¡G
a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ. include ferrite
a
b
c
Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.) G
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GENERAL SPECIFICATION ¡G
a¡ b¡ c¡ Storage temp. O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.5 time ( sec )
Temperature ( ¢J 250
50sec max.
G
¢ G Peak Temp¡
J J
Operating temp.
MB1608xxxx5x Datasheet
