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AK591024AS - 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory

General Description

The Accutek AK591024 high density memory modules is a random access memory organized in 1 Meg x 9 bit words.

The assembly consists of two 1 Meg x 4 and one 1 Meg x 1 DRAMs in surface mount packages mounted on the front side of a printed circuit board.

Key Features

  • 1,048,576 x 9 bit organization.
  • Optional 30 Pad SIM (Single In-Line Module) or 30 Pin leaded SIP (Single In-Line Package).
  • JEDEC standard pinout.
  • Common CAS, RAS and WE control for the lower eight bits.
  • 1024 refresh cycles/16ms.
  • Separate PCAS control for D9 and Q9.
  • Power: 1.650 Watt Max Active (60 nS) 1.485 Watt Max Active (70 nS) 1.265 Watt Max Active (80 nS) 23.5 mWatt Standby (max).
  • Operating free air temperature: 0o to 70oC.
  • Upward compatible wi.

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Datasheet Details

Part number AK591024AS
Manufacturer ACCUTEK
File Size 161.35 KB
Description 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
Datasheet download datasheet AK591024AS Datasheet

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Other Datasheets by ACCUTEK

Part Number Description
AK591024AG 1048576 Word x 9 Bit CMOS Dynamic Random Access Memory
AK5916384G 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
AK5916384S 16777216 Word by 9 Bit CMOS Dynamic Random Access Memory
AK59256AG 262144 Word by 32 Bit CMOS Dynamic Random Access Memory
AK59256AS 262144 Word by 32 Bit CMOS Dynamic Random Access Memory

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK591024 high density memory modules is a random access memory organized in 1 Meg x 9 bit words. The assembly consists of two 1 Meg x 4 and one 1 Meg x 1 DRAMs in surface mount packages mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. This packaging approach provides a better than 6 to 1 density increase over standard DIP packaging. The operation of the AK591024 is identical to two 1 Meg x 4 plus one 1 Meg x 1 DRAMs. For the lower eight bits, the data input is tied to data output and brought out separately for each 1 Meg x 4 device, with common RAS, CAS and WE control.