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RT3PE3000L - Radiation-Tolerant ProASIC3 Low-Power Space-Flight Flash FPGAs

Download the RT3PE3000L datasheet PDF. This datasheet also covers the RT3PE600L variant, as both devices belong to the same radiation-tolerant proasic3 low-power space-flight flash fpgas family and are provided as variant models within a single manufacturer datasheet.

Description

The radiation-tolerant (RT) ProASIC3 family of Actel flash FPGAs dramatically reduces dynamic power consumption by 40% and static power by 50%.

Features

  • MIL-STD-883 Class B Qualified Packaging.
  • Ceramic Column Grid Array with Six Sigma CopperWrapped Lead-Tin Columns.
  • Land Grid Array.
  • High-Performance, Low-Skew Global Network.
  • Architecture Supports Ultra-High Utilization ® Advanced and Pro (Professional) I/Os.
  • 700 Mbps DDR, LVDS-Capable I/Os.
  • 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation.
  • Bank-Selectable I/O Voltages.
  • up to 8 Banks per Chip.
  • Single-End.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (RT3PE600L_ACTEL.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number RT3PE3000L
Manufacturer ACTEL
File Size 3.60 MB
Description Radiation-Tolerant ProASIC3 Low-Power Space-Flight Flash FPGAs
Datasheet download datasheet RT3PE3000L Datasheet

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Other Datasheets by ACTEL

Part Number Description
RT3PE600L Radiation-Tolerant ProASIC3 Low-Power Space-Flight Flash FPGAs

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet.co.kr Advance v0.1 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma CopperWrapped Lead-Tin Columns • Land Grid Array • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization ® Advanced and Pro (Professional) I/Os • 700 Mbps DDR, LVDS-Capable I/Os • 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 8 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.
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