AFSEMI SSC8424GT3
This device is produced with high cell density DMOS trench technology, which is especially used to minimize on-state resistance. This device particularly suits low voltage applications such as portable equipment, power management and other battery powered circuits, and low in-line power dissipation are needed in a very small outline surface mount package.FEATURES
VDS VGS RDSon TYP 10mR@4V5 ID●
APPLICATIONS
● Load Switch● Portable Devices
● DCDC Conversion 20V ±8V 12mR@2V5 16mR@1V8 20A
● Pin Configuration
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GENERAL DESCRIPTION
Top View Excellent thermal and electrical capabilities.● Package Information SSC-V1.0 1/4 Analog Future SSC8424GT3
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ABSOLUTE MAXIMUM RATINGS
@ TA = 25°C unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Drain Current Power Dissipation(1) Continuous Pulsed Operating and Storage Junction Temperature Range Symbol VDSS V