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AMIS-720442-A Datasheet PDF

AMI SEMICONDUCTOR AMIS-720442-A

the AMIS-720442-A sensor chip. The location is referenced to the lower left corner of the die. The wafer thickness is 350µcrons.
Part No. AMIS-720442-A
Datasheet AMIS-720442-A Download
Manufacturer
AMI SEMICONDUCTOR
Description Image Sensor
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AMIS-720442-A datasheet page 1 preview

DESCRIPTION

AMI Semiconductor’s AMIS-720442-A (PI3042A) contact image sensor (CIS) is a 400 dots per inch (dpi) linear array image sensor chip. The sensor chip is processed using a CMOS image sensing technology, belonging to AMIS. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the manufacturers to produce variable CIS module lengths in increments of chip array lengths. This allows a wide variety of image reading widths which are easily applied to the numerous document scanners found in facsimile, as well as the narrow width scanners, such as, those found in check reader, lotto tickets, entrance gates tickets, etc. Included in this list of scanners are various types of automated office equipment which require a wide variety of scanning widths. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector elements, their associated multiplexing switches, buffers and a chip selector.
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