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PI3033B Datasheet PDF

AMI SEMICONDUCTOR PI3033B

The sensor chip is processed with PIC’s proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in varying sensing array lengths.
Part No. PI3033B
Datasheet PI3033B Download
Manufacturer
AMI SEMICONDUCTOR
Description Contact Image Sensor
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PI3033B datasheet page 1 preview

DESCRIPTION

: Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per inch resolution, linear array image sensor chip. Accordingly offering image reading widths to suit document scanners found in facsimile, scanner, check reader, and office automation equipment. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detector's elementto-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad symbols and functions are described in Table 1. 7950 m Row of 64 Sensors and Video Signal Multiplexers Readout Shift Register 500 m Buffer SP Buffer CP VDD DGND Chip Select IOUT RSTLEV Buffer AGND EOS Figure 1. PI3033B Block Diagram SYMBOL SP CP VDD DGND RSTLEV IOUT AGND EOS FUNCTION Start Pulse: Input to start the line scan.
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