AN-0001 - Surface Mount Assembly

ANADIGICS

Datasheet Details

Part number	AN-0001
Manufacturer	ANADIGICS
File Size	132.26 KB
Description	Surface Mount Assembly
Datasheet	AN-0001 Datasheet

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Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package. These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be correctly soldered for proper electrical contact to the PCB. The appropriate steps should be taken during PCB design and assembly to guarantee optimum performance from the power amplifiers. This application note outlines the steps necessary for the handling and assembly of ANADIGICS power amplifiers. 2.0 Requirements 2.1 PCB Design Guidelines: 1. PCB land and solder masking recommendations are shown in Figure 1.