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FEATURES • InGaP HBT Technology • 2.5% EVM @ +28 dBm (OFDMA) • 31 dB Gain • Integrated Step Attenuator • Integrated Output Power Detector • High Efficiency • Low Transistor Junction Temperature • Matched for a 50 Ω System • Low Profile Miniature Surface Mount Package;
RoHS Compliant
APPLICATIONS • WiMAX and LTE Air Interfaces • Picocell, Femtocell, Home Nodes • Customer Premises Equipment (CPE) • Data Cards and Terminals
AWB7221
2.30 GHz to 2.70 GHz Small-Cell Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.1
M52 Package 14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION The AWB7221 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications.