AWS5522 Overview
Description
Common port bias voltage (logic high) RF port, path 1 Ground Control voltage, RF path 1 Control voltage, RF path 2 Ground RF port, path 2 Common port bias voltage (logic high) RF common port VS1 RF1G RF1 RF1G V1 RFC V2 V1 V2 RF2G RF2G RF2 RF2 VS2 VS2 RFC Dimensions in µm. Bond Pads: 100µm x75µm Die Thickness: 178µm No backside metal.
