SMA4751A
Overview
- Glass passivated chip
- Low leakage
- Built-in strain relief
- Low inductance
- High peak reverse power dissipation
- Lead (Pb)-free component
- For use in stabilizing and clipping circuits with high power rating Mechanical Data
- Case: Molded plastic
- Epoxy: UL 94V-0 rate flame retardant
- Lead: Solderable per MIL-STD-750, method 2026
