CPA241
CPA241 is HIGH POWER OPERATIONAL AMPLIFIER manufactured by APEX.
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M I C R O T E C H N O L O G Y
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ABSOLUTE MAXIMUM RATINGS
SUPPLY VOLTAGE, +VS to
- VS OUTPUT CURRENT, continuous INPUT VOLTAGE, differential INPUT VOLTAGE, mon mode TEMPERATURE, junction
350V 60m A ±16V ±VS 150°C
NOTE:
Refer to parent product data sheet PA241 for typical AC electrical characteristics, precautions, applications and other test parameters.
DC WAFER PROBED SPECIFICATIONS
PARAMETER TEST CONDITIONS1 MIN TYP MAX UNITS m V p A d B V m A OFFSET VOLTAGE, initial VS = ±50V BIAS CURRENT, initial MON MODE REJECTION VCM = ±90 V DC 84 VOLTAGE SWING IO = 40m A ±VS- 12 SUPPLY CURRENT, quiescent VS = ±50 V 1.8 15 40 56 200 94 ±VS- 10 2.1 2.3
NOTES: 1. Unless otherwise stated VS = ±50 V, TA = 25°C, DC input specification ± value given. 2. Sample tested by wafer to 95%.
TYPICAL EXTERNAL CONNECTIONS
74 3- 7- / m74 3'
DIE LAYOUT
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- Required ponent and value if given. Optional balance ponents are remended values. CC is NPO, rated for full supply voltage
- VS to +VS. NOTE: Diagram for connection illustration only. All op amp configurations are possible. Pad Function 1 Output 2 pensation 3 pensation .. 4 Current Limit Pad 5 6 8 9 Function +Vs -Vs +IN -IN
Dimension: 154.5 x 117.5 ± 2.5 Mils. Thickness: 15 Mil (380µ). Backside Metal: None, Silicon. Bond pad: 5 Mil sq (127µ) AI. Make no connection to bond pads not listed by function. Note: The backside of the CPA241 die is isolated up to 500V. The top side walls of the CPA241 die are isolated up to 300V. Ordering Information: Order #: CPA241DI80: Die are only available in waffle packages with a total of 80 die per package.
CAUTION
The CPA241 is a MOSFET amplifier. ESD handling procedures must be observed
This data sheet has been carefully checked and is believed to be reliable, however,...
