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AAP200B - ECM Microphone Pre-Amplifier

This page provides the datasheet information for the AAP200B, a member of the AAP200A ECM Microphone Pre-Amplifier family.

Description

The AAP200C is part of AAI’s new family of specialty products for Portable Electronics applications, in this case aimed at two terminal ECMs requiring integrated pre-amplifiers.

The AAP200X ECM pre-amplifiers offer ultra low noise, require low current and feature ultra low input capacitance.

Features

  • Multiple gain options: ¬ 16dB ¬ 19dB.
  • Multiple output voltage options ¬ 1.25V ¬ 1.33V.
  • Low quiescent current, 200µA typical (VDD=1.8V, RL=2.2kΩ).
  • Low noise performance.
  • Low input capacitance, 0.35uA typical.
  • < 0.5% THD typical for output swing = 250mV peak to peak.
  • Small die size: 630µm x 530µm.
  • Suitable for small microphones down to 2mm diameter PIN.

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Datasheet preview – AAP200B

Datasheet Details

Part number AAP200B
Manufacturer ASIC
File Size 196.85 KB
Description ECM Microphone Pre-Amplifier
Datasheet download datasheet AAP200B Datasheet
Additional preview pages of the AAP200B datasheet.
Other Datasheets by ASIC

Full PDF Text Transcription

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Portable Electronics AAP200X   AAP200X ECM Microphone Pre-Amplifier PRELIMINARY DATA DESCRIPTION The AAP200C is part of AAI’s new family of specialty products for Portable Electronics applications, in this case aimed at two terminal ECMs requiring integrated pre-amplifiers. The AAP200X ECM pre-amplifiers offer ultra low noise, require low current and feature ultra low input capacitance. The AAP200X family will be offered in a chip scale SMD package. The package size is a tiny 630µm x 530µm, and its height is 350µm including solder bumps. The AAP200X is offered in a chip scale SMD package with a size and aspect ratio (630µm x 530µm) that is optimum for the smallest (2mm dia.) microphones. The lead free solder pads are nominally 110µm dia.
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