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FCD4B14CCB - Thermal Fingerprint Sensor with 0.4 mm x 14 mm Sensing Area and Digital Output

General Description

For DIP Ceramic Package Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Name GND AVE TPP VCC RST OE De0 De1 De2 De3 FPL Do3 Do2 Do1 Do0 GND ACKN PCLK TPE AVO Type GND Analog output Power Power Digital input Digital input Digital output Digital output Digital output Digital output GND D

Key Features

  • Sensitive Layer Over a 0.8 µm CMOS Array Image Zone: 0.4 x 14 mm = 0.02" x 0.55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 µm x 50 µm = 500 dpi Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second Die Size: 1.7 x 17.3 mm Operating Voltage: 3V to 5.5V Naturally Protected Against ESD: > 16 kV Air Discharge Power Consumption: 20 mW at 3.3V, 1 MHz, 25°C Operating.

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Other Datasheets by Atmel (now Microchip Technology)

Part Number Description
FCD4B14CC Thermal Fingerprint Sensor with 0.4 mm x 14 mm Sensing Area and Digital Output
FCD4B14 Thermal Fingerprint Sensor with 0.4 mm x 14 mm Sensing Area and Digital Output

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Features • • • • • • • • • • • • Sensitive Layer Over a 0.8 µm CMOS Array Image Zone: 0.4 x 14 mm = 0.02" x 0.55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 µm x 50 µm = 500 dpi Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second Die Size: 1.7 x 17.3 mm Operating Voltage: 3V to 5.5V Naturally Protected Against ESD: > 16 kV Air Discharge Power Consumption: 20 mW at 3.