HDJD-J822 Datasheet | AVAGO TECHNOLOGIES

Description The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC. Avago .. Technologies tests parts at the absolute maximum rated conditions remended for the device. The actual performance you obtain from Avago Technologies parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. Failure Rate Prediction The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: TJ(°C) = TA(°C) + θJAPAVG where: TA = ambient temperature in °C θJA = thermal resistance of junction-to-ambient in °C/ Watt PAVG = average power dissipated in Watt The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.7e V. Table 1. Life Tests Demonstrated Performance Performance in Time (60% confidence) MTBF [1] 2.52 x 105 Failure Rate [2] (FIT) 3968 Test Name High Temperature Operating Life Stress Test Conditions TA = 85°C, AVdd = 5.5V, DVdd = 5.5V Total Device Hrs 231,000 Units Tested 231 Units Failed 0 Table 2. Ambient Temperature (°C) 85 75 65 55 45 35 Junction Temperature [3] (°C) 87 82 77 57 47 37 Performance in Time (60% Confidence) MTBF [1] (hrs) 2.52 x 105 4.81 x 105 9.52 x 105 1.97 x 106 4.25 x 106 9.65 x 106 2.32 x 107 Failure Rate [2] (FIT) 3968 2080 1050 508 235 104 Performance in Time (90% Confidence) MTBF (hrs) 1.00 x 105 1.91 x 105 3.79 x 105 7.83 x 105 1.69 x 106 3.84 x 106 9.22 x 106 Failure Rate (FIT) 9970 5225 2638 1277 591 260 25 27 43 108 .. Notes: 1. The 60% or 90% confidence MTBF represents the minimum level of reliability performance which is...