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HSMR-C280 - Miniature ChipLED

Key Features

  • LED with InGaN die.
  • Surface mount device 0402 footprint.
  • PCB package.
  • Compatible with reflow soldering.
  • Tape in 8mm carrier tape on a 7 inch diameter reel.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HSMR-C280 Miniature ChipLED Data Sheet Features  LED with InGaN die  Surface mount device 0402 footprint  PCB package  Compatible with reflow soldering  Tape in 8mm carrier tape on a 7 inch diameter reel Applications  Backlighting  Indicator Package Dimensions Note: 1. All dimensions are in millimeters (inches). 2. Tolerance ±0.1mm (±0.004in) unless otherwise specified. Caution: LEDs are ESD sensitive device. Please observe appropriate precautions during handling and processing. Absolute Maximum Value at TA = 25°C Parameter InGaN Blue Forward Current1 20 Peak Pulsing Current2 100 Power Dissipation 78 LED Junction Temperature 95 Operating Temperature Range -30 to 85 Storage Temperature Range -40 to 85 Note: 1. Derate as shown in Figure 5. 2.