ABSM2
ABSM2 is MICROPROCESSOR CRYSTALS MOLDED PLASTIC SURFACE MOUNT manufactured by Abracon Corporation.
FEATURES
:
- Wide frequency range.
- Excellent heat resistance.
- Economical surface mount design.
- Suitable for solder reflow.
- Plastic molded package incorporated cylindrical-type crystal.
APPLICATIONS:
- munication equipment.
- Measuring instruments.
- A / V equipment.
- High-density circuit boards.
Frequency Range 3.5 MHz
- 25 MHz Frequency Range 3.50MHz
- 70MHz Operation Mode Fundamental, AT S T A N D A R D S P E C I F I C A T IO NS Operation Mode 3.50MHz ~ 32MHz (Fundamental) Operating Temperature -10°C to + 60° C (See Options) 30MHz ~ 70MHz (3rd overtone) Storage Temperature -55°C to + 125° C Operating Temperature -10°C to +60°C (See Options) Frequency T o lerance @ 25°C ± 50 ppm max. (See Options) Storage Temperature -55°C to +125°C Frequency Stability over T e mp. ± 50 ppm max. (See Options) @ Frequency T o lerance 25°C ±50ppm max. (See Options) Equivalent Series Resistance 200 Ω for 3.5 MHz < F < 4.0 MHz Frequency Stability over T e mp. ±50ppm max. (See Options) (ESR) Maximum 150 Ω for 4.0 MHz <F < 6.0 MHz Equivalent Series Resistance 200 100 Ω max. for 3.5MHz < F< <10.0 4.00MHz Ω for 6.0 MHz < F MHz (ESR) 150 80 Ω max. for 4.0MHz 6.00MHz Ω for 10 MHz < < FF << 14.0 MHz Fundamental AT 100 50 Ω max. for 6.0MHz 12.0MHz _< Ω for 14 MHz < < FF < 25 MHz 50 Ω max. for 12.0MHz < F < 32.0MHz Shunt Capacitance C0 7 p F max. for Option) 30.0MHz < F < 36.0MHz 100 16 Ω max. Load Capacitance CL p F (See 3rd Overtone 80 Ω max. for 36.0MHz < F < 70.0MHz Drive Level 100 μΩ max. Shunt C0 7p F max. @Capacitance Aging 25° C First Year ± 5 pp m max. Load Capacitance C 18p F (See Options) Insulation Resistance L 500 M Ω min. at 100 Vdc ± 15V Drive Level 100μW max. Aging @ 25°C per Year ±5ppm max. Insulation Resistance 500MΩ min. at 100Vdc ±15V Environmental, and mechanical specifications, see appendix C. Group 2. Marking, see appendix G. Tape and Reel, see appendix H.(2,000 pcs / reel). Reflow profile, see appendix E. Application notes, see appendix A. Remended handling, see...