EX128-CS491 Datasheet | Actel Corporation

- 250 MHz Internal Performance, Low-Power Antifuse FPGA Advanced Small-Footprint Packages Pin-to-Pin patibility with e X mercial- and Industrial-Grade Devices Hot-Swap pliant I/Os Single-Chip Solution Nonvolatile Live on Power-Up - - - - - No Power-Up/Down Sequence Required for Supply Voltages Configurable Weak Resistor Pull-Up or Pull-Down for Tristated Outputs during Power-Up Individual Output Slew-Rate Control 2.5 V and 3.3 V I/Os Software Design Support with Actel Designer and Libero® Integrated Design Environment (IDE) Tools Up to 100% Resource Utilization with 100% Pin Locking Deterministic Timing Unique In-System Diagnostic and Verification Capability with Silicon Explorer II Boundary Scan Testing in pliance with IEEE Standard 1149.1 (JTAG) Fuse Lock™ Secure Programming Technology Prevents Reverse Engineering and Design Theft Product Profile Device Capacity System Gates Typical Gates Register Cells Dedicated Flip-Flops Maximum Flip-Flops binatorial Cells Maximum User I/Os Global Clocks Hardwired Routed Speed Grades- Temperature Grades- Package (by pin count) TQFP CSP e X64 3,000 2,000 64 128 128 84 1 2 Std. A 64, 100 49, 128 e X128 6,000 4,000 128 256 256 100 1 2 Std. A 64, 100 49, 128 e X256 12,000 8,000 256 512 512 132 1 2 Std. A 100 128, 180 Note: - The e X family is also offered in mercial and industrial temperature grades with - F, - P, and Std. speed grades. Refer to the e X Family FPGAs datasheet for more details. June 2006 © 2006 Actel Corporation i e X Automotive Family FPGAs Ordering Information .. e X128 A Application (Ambient Temperature Range) A = Automotive (-40˚C to 125˚C) Blank = mercial (0˚C to 70˚C) I = Industrial (-40˚C to 85˚C) Package Lead Count Lead-Free Packaging Blank = Standard Packaging G = Ro HS pliant Packaging Package Type TQ = Thin Quad Flat Pack (1.4mm pitch) CS = Chip-Scale Package (0.8mm pitch) Speed Grade Blank= Standard Speed P = Approximately 30% Faster than Standard F = Approximately 40% Slower than Standard...