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BL2012-10B2450 - Multilayer Chip Baluns

Download the BL2012-10B2450 datasheet PDF. This datasheet also covers the BL2012 variant, as both devices belong to the same multilayer chip baluns family and are provided as variant models within a single manufacturer datasheet.

Key Features

  •  Monolithic SMD with small, low-profile and light-weight type.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BL2012-AdvancedCeramicX.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BL2012-10B2450
Manufacturer Advanced Ceramic X
File Size 148.60 KB
Description Multilayer Chip Baluns
Datasheet download datasheet BL2012-10B2450 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features  Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B2450_ 2400 ~ 2500 50 100 1.0 max. 2.0 max. 180  10 2 max. Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity Part Number : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 12 months max. : 2W max.