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BL2012-10B2450 - Multilayer Chip Baluns

This page provides the datasheet information for the BL2012-10B2450, a member of the BL2012 Multilayer Chip Baluns family.

Datasheet Summary

Features

  •  Monolithic SMD with small, low-profile and light-weight type.

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Datasheet preview – BL2012-10B2450

Datasheet Details

Part number BL2012-10B2450
Manufacturer Advanced Ceramic X
File Size 148.60 KB
Description Multilayer Chip Baluns
Datasheet download datasheet BL2012-10B2450 Datasheet
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Full PDF Text Transcription

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BL 2012 Series Multilayer Chip Baluns ACX Advanced Ceramic X Features  Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Frequency Unbalanced Balanced Insertion Part Number Range Impedance Impedance Loss (MHz) (ohm) (ohm) (dB) VSWR @BW Phase Amplitude Difference Difference (degree) (dB) BL201210B2450_ 2400 ~ 2500 50 100 1.0 max. 2.0 max. 180  10 2 max. Q’ty/Reel (pcs) Operating Temperature Range Storage Temperature Range Storage Period Power Capacity Part Number : 4000 : -40 ~ +85 oC : -40 ~ +85 oC : 12 months max. : 2W max.
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