Advanced Semiconductor CBSL100
CBSL100 is Designed for PACKAGE STYLE .400 BAL FLG (C) .080x45° A B FULL R (4X).060 R E D C .1925 F H I N L G M FEATURES: • Input Matching Network • • Omnigold™ Metalization System MAXIMUM RATINGS IC VCBO VCEO VEBO PDISS TJ TSTG θ JC 25 A 60 V 30 V 3.0 V 310 W @ TC = 25 C -65 OC to +200 OC -65 OC to +150 OC 0.6 OC/W O DIM A B C D E F G H I J K L M N .395 / 10.03 .850 / 21.59 1.335 / 33.91 .003 / 0.08 .060 / 1.52 .082 / 2.08 .120 / 3.05 .380 / 9.65 .780 / 19.81 .435 / 11.05 1.090 / 27.69 MINIMUM inches / mm J K MAXIMUM inches / mm .220 / 5.59 .210 / 5.33 .230 / 5.84 .130 / 3.30 .390 / 9.91...DESCRIPTION
: The ASI CBSL100 is Designed for PACKAGE STYLE .400 BAL FLG (C) .080x45° A B FULL R (4X).060 R E D C .1925 F H I N L G MFEATURES
:● Input Matching Network
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● Omnigold™ Metalization System