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ATS-50170P-C2-R0 Datasheet Ultra High Performance Bga Cooling

Manufacturer: Advanced Thermal Solutions

Overview: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART #.

Key Features

  • & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard.

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