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ATS-50170P-C2-R0 - Ultra High Performance BGA Cooling

Key Features

  • & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard.

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Datasheet Details

Part number ATS-50170P-C2-R0
Manufacturer Advanced Thermal Solutions
File Size 323.55 KB
Description Ultra High Performance BGA Cooling
Datasheet download datasheet ATS-50170P-C2-R0 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-50170P-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm C D » » B A » » Thermal Performance Air Velocity *Image above is for illustration purposes only.