FEATURES & BENEFITS
» maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm C D » » B A » » THERMAL PERFORMANCE
Air Velocity *Image above is for illustration purposes only. Thermal Resistance FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 °C/W (UNDUCTED FLOW) 5.1 4.2 3.6 3.3 3 2.8 2.6 °C/W (DUCTED FLOW) 4.1 Product Details DIMENSION A 23 mm Notes: 2) 3) 4) 5) 6) DIMENSION B 23 mm DIMENSION C 17.5 mm DIMENSION D 41.5 mm INTERFACE MATERIAL Saint-gobain C1100F FINISH BLUE-ANODIZED 1) Dimension C = heat sink height from bottom of the base to the top of the fin field.