Datasheet4U Logo Datasheet4U.com

ACT-RS128K32 - 4 Megabit SRAM Multichip Module

Description

WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4 I/O0-31 Data I/O A0 A16 OE A0 16 Address Inputs WE1 4 Write Enables 128Kx8 128Kx8 128Kx8

Features

  • Preliminary s 4 Low Power CMOS 128K x 8 SRAMs in one MCM s Overall configuration as 128K x 32 s Tolerant to 30KRad (Si) s Latch-up Immunity to 112MeV/(mg/cm2) s Input and Output TTL Compatible s 35 & 45ns Access Times s Full Military (-55°C to +125°C) Temperature Range s For Class K devices per MIL-PRF-38534 - Consult Factory s +5V Power Supply s Choice of 4 Hermetically sealed Co-fired Packages: q 68.
  • Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max q 68.
  • Lead, Dual-Cavit.

📥 Download Datasheet

Datasheet preview – ACT-RS128K32

Datasheet Details

Part number ACT-RS128K32
Manufacturer Aeroflex
File Size 134.13 KB
Description 4 Megabit SRAM Multichip Module
Datasheet download datasheet ACT-RS128K32 Datasheet
Additional preview pages of the ACT-RS128K32 datasheet.
Other Datasheets by Aeroflex

Full PDF Text Transcription

Click to expand full text
RAD Tolerant ACT–RS128K32 High Speed 4 Megabit SRAM Multichip Module Features Preliminary s 4 Low Power CMOS 128K x 8 SRAMs in one MCM s Overall configuration as 128K x 32 s Tolerant to 30KRad (Si) s Latch-up Immunity to 112MeV/(mg/cm2) s Input and Output TTL Compatible s 35 & 45ns Access Times s Full Military (-55°C to +125°C) Temperature Range s For Class K devices per MIL-PRF-38534 - Consult Factory s +5V Power Supply s Choice of 4 Hermetically sealed Co-fired Packages: q 68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max q 68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness available, contact factory for details) (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) q 66–Lead, PGA-Type (P1), 1.385"SQ x .
Published: |