FEATURES
s 4 Low Power 128K x 8 FLASH Die in One MCM s MIL-PRF-38534 Compliant MCMs Available s Industry Standard Pinouts s Packaging – Hermetic Ceramic Package s Organized as 128K x 32 q User Configurable to 256K x 16 or 512K x 8 q Upgradable to 512K x 32 in same Package Style s Access Times of 60, 70, 90, 120 and 150ns s +5V Programing, 5V ±10% Supply s 100,000 Erase/Program Cycles Typical, 0°C to +70°C s Low Standby Current s TTL Compatible Inputs and CMOS Outputs s Embedded Erase and Program Algorithms s Page Program Operation and Internal Program Control Time s Commercial, Industrial and Military Temperature Ranges Lead, .88" x .88" x .160" Single-Cavity Small Outline gull wing, Aeroflex code# "F5" (Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint) q 66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder, Aeroflex code# "P3" q 66 Pin, 1.08" x 1.08" x .185" PGA Type, With Shoulder, Aeroflex code# "P7" s Sector Architecture (Each Die) q 8 Equal size sectors of 64K bytes each q Any Co...