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HSMS-280B - Surface Mount RF Schottky Barrier Diodes

This page provides the datasheet information for the HSMS-280B, a member of the HSMS-280x Surface Mount RF Schottky Barrier Diodes family.

Datasheet Summary

Description

These Schottky diodes are specifically designed for both analog and digital applications.

This series offers a wide range of specifications and package configurations to give the designer wide flexibility.

The HSMS-280x series of diodes is optimized for high voltage applications.

Features

  • Surface Mount Packages.
  • High Breakdown Voltage.
  • Low FIT (Failure in Time) Rate.

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Datasheet preview – HSMS-280B

Datasheet Details

Part number HSMS-280B
Manufacturer Agilent Technologies
File Size 286.68 KB
Description Surface Mount RF Schottky Barrier Diodes
Datasheet download datasheet HSMS-280B Datasheet
Additional preview pages of the HSMS-280B datasheet.

📁 Similar Datasheet

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Other Datasheets by Agilent Technologies
  • HSMS-2800 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2802 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2803 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2804 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2805 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2807 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-2808 - Surface Mount RF Schottky Barrier Diodes
  • HSMS-280C - Surface Mount RF Schottky Barrier Diodes

Full PDF Text Transcription

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www.DataSheet4U.com Agilent HSMS-280x Surface Mount RF Schottky Barrier Diodes Data Sheet Features • Surface Mount Packages • High Breakdown Voltage • Low FIT (Failure in Time) Rate* Description/Applications These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-280x series of diodes is optimized for high voltage applications. Note that Agilent’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
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