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AS4C16M16SA - 256M - (16M x 16bit) Synchronous DRAM

Key Features

  • Fast access time from clock: 5/5.4 ns.
  • Fast clock rate: 166/143 MHz.
  • Fully synchronous operation.
  • Internal pipelined architecture.
  • 4M word x 16-bit x 4-bank.
  • Programmable Mode registers - CAS Latency: 2 or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst stop function.
  • Operating temperature range - Commercial (0 ~ 70°C) - Industrial (-40 ~ 85°C).
  • Auto Refresh and Self Refresh.
  • 8192 refresh cycles/64ms.
  • C.

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Datasheet Details

Part number AS4C16M16SA
Manufacturer Alliance Semiconductor
File Size 1.06 MB
Description 256M - (16M x 16bit) Synchronous DRAM
Datasheet download datasheet AS4C16M16SA Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Confidential AS4C16M16SA 256M – (16Mx16bit) Synchronous DRAM (SDRAM) (Rev. 2.0 63nm, Mar /2014) Features  Fast access time from clock: 5/5.4 ns  Fast clock rate: 166/143 MHz  Fully synchronous operation  Internal pipelined architecture  4M word x 16-bit x 4-bank  Programmable Mode registers - CAS Latency: 2 or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst stop function  Operating temperature range - Commercial (0 ~ 70°C) - Industrial (-40 ~ 85°C)  Auto Refresh and Self Refresh  8192 refresh cycles/64ms  CKE power down mode  Single +3.3V ±0.3V power supply  Interface: LVTTL  54-pin 400 mil plastic TSOP II package  54-ball 8.0 x 8.0 x 1.