AOB14N50 Overview
Key Specifications
Package: TO-263-3
Mount Type: Surface Mount
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Description
Product Summary The AOT14N50 &AOB14N50 & AOTF14N50 have been fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS ID (at VGS=10V) RDS(ON) (at VGS=10V) 100% UIS Tested 100% Rg Tested TO-220 TO-220F Top View TO-263 D2PAK D 600V@150℃ 14A < 0.38W D G AOT14N50 DS G AOTF14N50 S GD S AOB14N50 G Parameter Symbol AOT14N50/AOB14N50 AOTF14N50 Drain-Source Voltage VDS 500 Gate-Source Voltage VGS ±30 Continuous Drain TC=25°C Current TC=100°C Pulsed Drain Current C Avalanche Current C Repetitive avalanche energy C Single plused avalanche energy G Peak diode recovery dv/dt ID IDM IAR EAR EAS dv/dt 14 14* 11 11* 56 6 540 1080 5 TC=25°C Power Dissipation B Derate above 25oC PD 278 2.2 50 0.4 Junction and Storage Temperature Range Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds TJ, TSTG TL -55 to 150 300 Parameter Maximum Junction-to-Ambient A,D Maximum Case-to-sink A Symbol RqJA RqCS AOT14N50/AOB14N50 65 0.5 AOTF14N50 65 -- Maximum Junction-to-Case RqJC 0.45 2.5 * Drain current limited by maximum junction temperature.
